Premium Akasa Case Solutions for Intel® NUC

Akasa is at the Venetian Expo, Booth 50972 at CES 2023, Jan 5th - 8th.

Akasa has announced updated versions of their most popular aftermarket fanless cases. These are designed and built for the latest 12th Gen NUC’s (Wall Street Canyon), and Intel's new LGA1700 socket design for the Mini-ITX and Thin Mini-ITX motherboard standards. The ultimate acoustic performance can be achieved with these premium fanless cases (built for up to 65W TDP), whilst keeping the desk footprint low for a tidy, small-form-factor build.