MeLE's Cyber X1 mini PC gained attention and controversy for its fanless design utilizing a unique, spiky top cover made of "high thermal-conductivity" engineering plastic instead of traditional metal. This "Micro-Pillar Array Cooling Technology" expands the heat dissipation surface area, allowing the Intel N150 CPU to run at a slightly higher performance limit (10W) compared to MeLE's Quieter 4C model.
